Abstract: The growth in e-commerce sales has been constant and, driven by the Covid-19 pandemic, has exceeded previous expectations. Owing to social isolation, parcel lockers - systems for goods ...
Abstract: Thermomechanical stress induced by through-silicon vias (TSVs) plays an important role in the performance and reliability analysis of 2.5D/3D ICs. While the finite element method (FEM) ...
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