For design teams adopting 3D-IC architectures, the relentless pursuit of performance and reliability brings a familiar, yet increasingly complex, set of challenges: how do we manage power, dissipate ...
Abstract: For next-generation advanced logic devices, gate-all-around field-effect transistors (GAAFETs) with characteristic size reaching the 10 nm scale, necessitate thorough consideration of ...
Materials science is an interdisciplinary field concerned with the understanding and application of the properties of matter. Materials scientists study the connections between the underlying ...
Abstract: In this paper, we introduce a novel electro-thermo-mechanical simulation framework utilizing the unified FDTD method for efficient and accurate analysis of electrical, thermal, stress, and ...
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