The electrochemical deposition (ECD) equipment market for IC packaging is heating up as 2.5D, 3D and fan-out technologies begin to ramp. Applied Materials recently rolled out an ECD system for IC ...
Momentum is building for IC packages based on an emerging technology called molded interconnect substrate (MIS). ASE, Carsem, JCET/STATS ChipPAC, Unisem and others are developing IC packages based on ...
BATAM, Indonesia--(BUSINESS WIRE)--Unisem, a global provider of semiconductor assembly and test services, today announced its QFN side wall plating capability and LFGA package offering at the ...
Manz AG, a global high-tech engineering company with a comprehensive technology portfolio, showcases its high-density packaging production solutions at the SEMICON Southeast Asia 2023 on May 23-25 in ...
Johnstech International has announced the release of its new Low-Force XL contacts for Pad ROL100A Series and Pad ROL200 Series test contactors for testing NiPdAu IC packages. The new contactors offer ...
Today’s electronic packages have high clock speeds (multi-gigahertz range), fine pin densities (below 0.4-mm pitch), and high pin counts (over 2000). When assembled onto a printed-circuit board (PCB), ...
Advanced IC packaging is a prominent technology highlight of the “More than Moore” arena. At a time when chip scaling is becoming more difficult and expensive at each node, engineers are putting ...
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