As ICs have progressed to becoming full systems, such as SOCs (systems on chips), they have been mirroring historical development and design issues that occur in PCB (printed-circuit-board) designs of ...

Today’s electronic devices market demands miniaturized printed circuit boards (PCBs) with a multitude of high-speed functions integrated on a single board. This causes the designers to have traces ...

Flexium Interconnect, a company specializing in flexible PCBs, has disclosed its intention to acquire the outstanding shares of IC design house Rafael Microelectronics for NT$170 (US$5.35) per share.

Siemens adds AI capabilities across EDA portfolio, enhancing productivity, accelerating innovation and speeding time-to-market New AI system enables EDA engineers to leverage AI securely within ...

[Hans Rosenberg] knows a thing or two about RF PCB design and has provided a three-part four-part video demonstration of some solid rules of thumb. We will cover the first part here and leave the ...

Advanced packaging continues to promise improved form factor, cost, performance, and functionality compared to the traditional transistor scaling on SoCs. This is done by integrating multiple dies on ...

6. SOT-23 and SOIC packages are typically used in low-power motor drivers. Standard leaded packages, like SOIC and SOT-23 packages, are often used for low-power motor drivers (Fig. 6). To maximize the ...

For many applications, next generation IC packaging is the best path to achieve silicon scaling, functional density, and heterogeneous integration while reducing the overall package size.

When analyzing the supply and demand of global semiconductor design talents in 2021, one finds US-based companies to be the main source of chip design demand. US-based companies accounted for 43% of ...

Printed-circuit-board (PCB) substrate material, like FR-4 glass epoxy, is a poor conductor of heat. Conversely, copper is an excellent conductor of heat. So, more copper area on a PCB is ideal from a ...