Ansys® Redhawk-SC™ and Ansys® Totem™ power integrity platforms are certified for TSMC's industry-leading N3 and N4 process technologies TSMC's certifications will help customers speed design flow ...
Ansys and TSMC extend partnership to deliver high-speed and high-capacity power integrity signoff design solutions spanning 16nm to 5nm processes PITTSBURGH, May 6, 2020 /PRNewswire/ -- Ansys (NASDAQ: ...
Ansys (ANSS) and TSMC deliver a high-fidelity multiphysics solution to address design challenges for artificial intelligence (AI), datacenter, cloud, and high-performance computing (HPC) chips The ...
Join our daily and weekly newsletters for the latest updates and exclusive content on industry-leading AI coverage. Learn More Ansys partnered Supermicro and Nvidia to deliver turnkey hardware, ...
Modern Ansys Design Language elevates the user experience (UX) to create a new user interface (UI) paradigm across the Ansys (ANSS) multiphysics portfolio and increases accessibility Native Ansys ...
Ansys ANSS recently announced a collaboration with Taiwan Semiconductor Manufacturing Company (“TSMC”) on the latter’s Compact Universal Photonic Engines (COUPE) platform. The collaboration aims to ...
Ansys platform supports TSMC's N6RF Design Reference Flow to help enable faster and higher performance radio frequency chips for 5G, Wi-Fi, and IoT with TSMC's N6RF process technology PITTSBURGH -- ...
Ansys (NASDAQ: ANSS) achieved certification of its cutting-edge multiphysics signoff solutions for TSMC’s advanced N3 and N4 process technologies. This enables joint customers to meet critical power, ...
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