Testing Devices In Module Packages And Designing Cryogenic Current Sensors For All-Electric Aircraft
A technical paper titled “Characterizing semiconductor devices for all-electric aircraft” was published by researchers at University of Strathclyde (Glasgow) and Airbus UpNext. “Cryogenic propulsion ...
System-in-package (SiP) and other advanced packaging technologies are putting more components together in tighter spaces than previously seen. Often these packages are contained in a module, which is ...
Wilsonville, OR. Mentor Graphics today announced a new MicReD Power Tester 600A product, which tests electric and hybrid vehicle (EV/HEV) power electronics reliability during power cycling. The MicReD ...
At PCIM Europe, Power Integrations announced the SCALE EV family of gate-driver boards for Infineon EconoDUAL modules. The SCALE EV family consists of automotive-qualified, dual-channel plug-and-play ...
Mitsubishi Electric Corporation (TOKYO: 6503) announced today that it will begin shipping samples of ten new models of its industrial-use NX-type 1.2kV insulated gate bipolar transistor (IGBT) module ...
Power Integrations announced a family of gate-driver boards for Infineon EconoDual power switching modules. The family is called Scale EV, and its first member is 2SP0215F2Q0C, designed for the ...
Infineon Technologies AG has launched the new TRENCHSTOP 1700-V IGBT7 chip in the standard EconoDUAL 3 industrial module package. With the new IGBT7 chip technology, the EconoDUAL 3 claims leading ...
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