Next generation wireless modules combine innovative and proven RFIC/MMIC designs into a single package―delivering superior performance, lower power consumption, and reduced size, weight, and cost.
The company said Cadence ChipStack AI Super Agent will help revolutionize how engineers automate chip design by improving ...
Electronic Design’s Andy Turudic talks with Georgia Tech’s Shaolan Li about a hands-on course centered on silicon design that takes you from schematic through tapeout. In this episode of Inside ...
Announces Synopsys.ai customer momentum with applications including DSO.ai and VSO.ai delivering significant improvements in PPA, turn-around time, and more; Drives multi-die design innovation with ...
TEWKSBURY, Mass.--(BUSINESS WIRE)--Avery Design Systems, leader in functional verification solutions today announced the pre-silicon system simulation solution of NVMe TM SSD and PCIe® designs using ...
Silicon photonics is rewiring the future of data centers. But engineers need more advanced simulation tools to integrate these light-slinging components with electronics. How silicon photonics ...
Semiconductor development is currently in one of its periodic crises, with many factors combining to require dramatically new technologies and methodologies. Chips continue to grow ever larger and ...
Synopsys Users Group (SNUG) Taiwan 2024 demonstrated the state-of-the-art EDA innovations and Artificial intelligence (AI) driven solutions for the chip design community. With the theme of "Our ...
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