Sawnics announced a process design kit (PDK) based on Soitec’s Connect piezo-on-insulator (POI) substrates to accelerate RF filter design for 5G smartphones. The South Korean foundry, with expertise ...
Siemens’ Xpedition Substrate Integrator provides co-design prototyping and planning of 2.5/3D chips.
Why co-optimization is needed when designing 2.5D and 3D chips. The tools provided by Siemens for 2.5D and 3D chip design and packaging. The latest high-performance chips often employ 2.5D and 3D chip ...
The flexible display's substrate is critical to e-paper's and e-ink's development. Many different types of materials are under investigation, including glass, plastic, polymer films, and metallic ...
SANTA CLARA, Calif.--(BUSINESS WIRE)--TSMC (TSE: 2330, NYSE: TSM) today announced the new 3Dblox 2.0 open standard and major achievements of its Open Innovation Platform ® (OIP) 3DFabric Alliance at ...
Antenna packaging methodologies have evolved significantly to counter the escalating signal attenuation in high-frequency communications like 5G mmWave and anticipated 6G networks. Benchmark of ...
Highlighting FD-SOI's existing strengths in cybersecurity. Co-developing innovations across the substrate-design stack to boost physical robustness and meet security requirements in automotive and ...
Today’s heterogeneously integrated semiconductor packages represent a breakthrough technology that enables dramatic increases in bandwidth and performance with reduced power and cost compared to what ...
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