Silicides — alloys of silicon and metals long used in microelectronics — are now being explored again for quantum hardware. But their use faces a critical challenge: achieving phase purity, since some ...
Chiplets and advanced packaging have been on the cutting-edge of electronic technology for a while, but Intel is changing where it might be headed. Today’s organic substrates, like Ajinomoto build-up ...
Siemens’ Xpedition Substrate Integrator provides co-design prototyping and planning of 2.5/3D chips.
Why co-optimization is needed when designing 2.5D and 3D chips. The tools provided by Siemens for 2.5D and 3D chip design and packaging. The latest high-performance chips often employ 2.5D and 3D chip ...
SPHBM4 cuts pin counts dramatically while preserving hyperscale-class bandwidth performance Organic substrates reduce packaging costs and relax routing constraints in HBM designs Serialization shifts ...
A research team maps the key tasks that define modern enzyme engineering—function annotation, structure modeling, and property prediction—and explain how AI methods now accelerate each step, from ...
Intel has provided more details about the glass substrate at its annual event while promising to deliver 1 trillion transistors in a package by 2030. At the “Intel Innovation” event in San Jose, ...
SPHBM4 cuts pin counts dramatically while preserving hyperscale-class bandwidth performance Organic substrates reduce packaging costs and relax routing constraints in HBM designs Serialization shifts ...
Silicides could advance quantum hardware, but phase purity is difficult; a new study finds hafnium oxide substrates help stabilize the superconducting phase. (Nanowerk News) Silicides — alloys of ...
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