1. The OSD335x is an example of a complete system fitting into a tiny BGA package. We also discussed the advantages SiP brings to the design and manufacturing of semiconductors and how they can be ...

System-in-package (SiP) technology is at the beginning of its revolution. Some see the SiP in the same way as a system on chip (SoC)—as an IC component with no simple path to further customization.

Military and aerospace (mil-aero) applications, from satellites and rockets to ships and planes, increasingly require electronic systems and subsystems with high functionality and performance in a ...

Timely and effective development of system-in-package (SiP) alternatives has driven the need for broader supplier collaboration on system-partitioning decisions within the electronics food chain.

A technical paper titled “Cost-Aware Exploration for Chiplet-Based Architecture with Advanced Packaging Technologies” was published by researchers at UCSB, University of California, Santa Barbara.