Tessera Inc. said Monday (April 14) it will introduce chip-scale packaging technology the company claims provides performance, size, and cost advantages for designers of RF modules used in wireless ...

TOKYO — Sanyo Electric Co. Ltd. and Infineon Technologies AG will cooperate on the production of high-frequency RF devices by merging Infineon's RF devices with Sanyo's packaging technology. Under the ...

RF and microwave integrated circuits (ICs), monolithic microwave ICs (MMICs) and systems in package (SiPs) are vital for a wide range of applications. These include mobile phones, wireless local-area ...

The market for portable and mobile data access devices that are wirelessly connected to the cloud anytime and anywhere is exploding. The trend to access any network from anywhere is driving increased ...