Advanced packaging is transforming semiconductor manufacturing into a multi-dimensional challenge, blending 2D front-end wafer fabrication with 2.5D/3D assemblies, high-frequency device ...

Without internal work ( u = 0), convergence of automatic operations to controlled standards occurs only if the memory ...

While dynamic modeling is arguably one of the most important technological developments for engineers in the last 50 years, many process control engineers are unable to use it. It requires proper time ...

The next steps beyond 5G promise great advantages in terms of bandwidth and latency, making possible many new process-control ...

Experimental projects dealing with heat transfer, mass transfer, separations processes, chemical reaction engineering, process dynamics, and process control. Written and oral reports required.

Just over a decade ago, an article titled, "Advanced Control Strategies Move into the Field" (Control, October 2008), highlighted three evolving trends in the process control world that would "make ...