In general, the distribution of copper foil on a PCB board is very complicated and difficult to accurately model. Modeling can result in uneven distribution of copper foil during PCB manufacturer ...

Advances in the development of high power and high performance electronic devices demand innovative approaches for heat transfer materials. While it is given that thermal performance must be maximized ...

The trend in end-equipment design is to optimize the module profile for sizing. This introduces a migration from metal heat sinks to PCB copper plane-based thermal management. Today’s modules use ...

Electronics companies at the leading edge of performance are being forced to address board-level thermal requirements at the earliest stages of design. Printed circuit boards (PCBs) constitute the ...