System-in-package (SiP) and other advanced packaging technologies are putting more components together in tighter spaces than previously seen. Often these packages are contained in a module, which is ...
Production test of a finished electronic product often involves two techniques: in-circuit test (ICT) and functional component test (FCT). The ICT technique examines a non-powered circuit board to ...
Even a small array consisting of 100 elements has thousands of individual components that require perhaps 25,000 measurements per module for an eye-watering grand ...
San Francisco, CA. Advantest at SEMICON West demonstrated that it is supporting both its T2000 and V93000 test platforms. For the latter, the company introduced the PVI8 floating power source, and for ...
Traditional PV inspection methods using direct current polarisation have proved unreliable in detecting certain issues. Researchers from Enertis Applus+ detail a new approach to defect detection aimed ...
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