The Nature Index 2025 Research Leaders — previously known as Annual Tables — reveal the leading institutions and countries/territories in the natural and health sciences, according to their output in ...
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Joint research validates new semiconductor etching process, achieving five times speed improvement
A collaborative research team from Nagoya University and Tokyo Electron Miyagi Ltd. has demonstrated that the company's new ...
Significant ionic and neutral species, including C x F y (X>2), C x HF y, and C x F y (Y/X<2), have been reported by quadrupole mass-spectroscopy in the unique C 5 HF 7 /O 2 /Ar plasma. When compared ...
(Nanowerk News) Imec and KLA Tencor have established a metrology method for optimizing the etch rate uniformity (ERU) in a transformer coupled plasma (TCP) reactor. The proposed metrology method makes ...
In dry etching, the trajectory of accelerated ions is non-uniform and non-vertical, due to collisions with gas molecules and other random thermal effects (figure 1). This has an impact on etch results ...
The process comprises a surface nitrogenation step via N + ion bombardment, followed by O 2 plasma treatment to form volatile etching byproducts. This approach enables subatomic-level etching ...
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