Electronic packaging has continued to become more complex with higher device count, higher power densities and Heterogeneous Integration (HI) becoming more common. In the mobile space, systems that ...

Even with robotics, traditional development and production are time-consuming and error-prone. You can optimize downstream workflows with computer-aided design (CAD) and computer-aided engineering ...

Typical 3D thermal simulation of electronics components assumes that all the power consumption the data sheets define is dissipated in the semiconductor. In the case of high current power modules, ...

Some of the important trends driving EV development are getting more than 200 miles out of a charge, pricing below $40,000, fast charging such as less than 30 minutes for an 80% charge, increasing ...

French scientists have developed a fully coupled opto-electro-thermal model that reportedly predicts solar cell behavior under real operating conditions in a standalone framework. They said the model ...