Thin-film, single- and multi-layer high-density interconnects (HDIs) have been developed that integrate conductor patterns and other passive components to form low-noise products with enhanced signal ...

The transition to copper and 90-nanometer process nodes has raised the specter of increased interconnect process variation. Physical variations in copper interconnect lead to interconnect ...

Interconnects are becoming increasingly challenging to design, implement and test as the amount of data skyrockets and the ability to move that data through denser arrays of compute elements and ...

Anew interconnect technology, called Solderball Pin, from interconnect manufacturer Autosplice (San Diego, CA), enables automation of individually placed surface-mount pins on pc boards. Unlike ...