Stacking dies introduces layers of complexity driven by multi-physics interactions, which must be addressed at the start of ...
Protection against ESD events (commonly referred to as ESD robustness) is an extremely important aspect of integrated circuit (IC) design and verification, including 2.5/3D designs. ESD events cause ...
A new technical paper titled “DeepOHeat: Operator Learning-based Ultra-fast Thermal Simulation in 3D-IC Design” was published (preprint) by researchers at UCSB and Cadence. “Thermal issue is a major ...
Design Tools Selected in TSMC's First Integrated, Validated Reference Flow and Design Kit Enabling Multi-Die Integration Using TSMC CoWoS Technology MOUNTAIN VIEW, Calif., Oct. 11, 2012-- Synopsys, ...
The mainstream adoption of 3D-IC has become a question mark due to critical challenges ranging from early-stage chip designs to 3D assembly exploration to final design signoff. A new EDA tool claims ...
As the semiconductor industry approaches a projected market value of $1 trillion by 2030, the transition from traditional monolithic architectures to modular chiplet-based designs represents a ...
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