A new approach combining atomic layer deposition and organic film etch process may solve critical challenges in the various processes in advanced nodes. We demonstrated a high selective and ...
An extensive range of insulating thin films are utilized in modern VLSI circuits providing electrical isolation between conducting regions within a device and as a final capping passivation layer.
In dry etching, the trajectory of accelerated ions is non-uniform and non-vertical, due to collisions with gas molecules and other random thermal effects (figure 1). This has an impact on etch results ...
(Nanowerk News) Imec and KLA Tencor have established a metrology method for optimizing the etch rate uniformity (ERU) in a transformer coupled plasma (TCP) reactor. The proposed metrology method makes ...
Semiconductors are a crucial element of electronic equipment, allowing for advancements in telecommunications, computers, biotechnology, weapons technology, aviation, renewable energy, and a variety ...
In this technique, fluorine-based plasma chemistry is used for silicon etching, which is combined with a fluorocarbon plasma process to offer sidewall passivation and enhanced selectivity to masking ...
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