At APEC 2025, Nexperia announced several important additions to its portfolio of enhancement-mode GaN and SiC devices. Among them is a new series of 1,200-V SIC MOSFETs available in thermally enhanced ...
These four SiC modules leverage Qorvo’s unique cascode configuration, which minimizes R DS(on) and switching losses to maximize efficiency, especially in soft-switching applications, Qorvo said. In ...
Power Integrations announced the release of its SCALE™-2+ dual IGBT-driver core, the 2SC0435T2G1-17, which is the most compact product in its power range with a footprint of only 57.2 x 51.6 mm and a ...
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