Jinman Han is President of Samsung Semiconductor, Inc. & leads the U.S. business, including Memory, Foundry, System LSI and LED. Almost every innovation introduced to the world has been touted as the ...

ONTO shares have surged 51.8% in six months, driven by AI-driven advanced packaging demand, Dragonfly uptake, factory ramp-ups and accretive acquisitions.

Strategic partnerships and global collaboration are required to bring advanced packaging from research to real-world impact.

Advanced packaging mechanisms play a vital role in reducing food waste and ensuring the maintenance of quality during storage. An incredible challenge faced by the food industry is the development of ...

MILPITAS, Calif., Sept. 21, 2020 /PRNewswire/ -- Today, KLA Corporation (NASDAQ: KLAC) announced the launch of the Kronos™ 1190 wafer-level packaging inspection system, the ICOS™ F160XP die sorting ...

Just as the new plant located in Nanke Chiayi Park in Taiwan is expanding production, the downstream supply chain broke news that TSMC is eyeing off going to Pingtung to build a new CoWoS advanced ...

GF will make an initial investment of $575M, create 100 jobs at the New York Advanced Packaging and Photonics Center in Malta. G lobalFoundries (GF) plans to create a new center for advanced packaging ...

Burlingame, CA, Aug. 20, 2025 (GLOBE NEWSWIRE) -- Advanced Chip Packaging Market to Reach USD 50.38 Billion in 2025 as Demand for High-Performance and Miniaturized Devices Rises The Global Advanced ...

CEO Bill Miller highlighted 2024 as a successful year with milestones such as shipping an LSA system for 2-nanometer gate all-around logic chips and an agreement to ship an LSA evaluation to a second ...

South Korean TC bonder (TCB) manufacturer Hanwha Semitech recently announced an organizational restructuring aimed at strengthening its development capabilities for next-generation... Despite flat ...

Driving R&D of glass components for scaling of semiconductor packaging substrates Tokyo, Japan, December 16, 2025 -- TOPPAN Inc. (TOPPAN), a ...

A new technical paper titled “A review of the thermo-mechanical analysis framework for microelectronics packaging: Mechanics, ...