In the rapidly evolving world of ASIC design, the shift from monolithic to 2.5D and 3D multi-die architectures represents a significant leap forward. This approach, which integrates multiple chiplets ...

A new technical paper titled “Leveraging 3D Technologies for Hardware Security: Opportunities and Challenges” was published by researchers at the University of California, Santa Barbara and Columbia ...

Two software tools, Innovator3D IC and Calibre 3DStress, address chiplet integration and thermal management at the transistor level. Siemens Digital Industries Software announced the duo at DAC 2025.

New Delhi [India], November 13: Novatr, a leading force in technology-driven upskilling for the AEC (Architecture, Engineering, Construction) sector, is set to host an insightful online masterclass ...

Using a computer and modern software can be a chore to begin with for the visually impaired, but fundamentally visual tasks like 3D design are even harder. This Stanford team is working on a way to ...

2.5D/3D IC designs present new challenges in both ESD design and verification. Advanced automated ESD verification methodology accurately and effectively evaluates ESD protection in 2.5/3D IC designs.

Stratasys' "programmable materials" are a technological breakthrough. Just when many folks on Main Street were being introduced to 3D printing last year, a new technology that makes it seem downright ...