A 4D film combines physical, tactile experiences with 3D presentation. Water cannons, leg ticklers and back pokers are just a few of the devices to have soaked, tickled and prodded audiences in the ...

In the rapidly evolving world of ASIC design, the shift from monolithic to 2.5D and 3D multi-die architectures represents a significant leap forward. This approach, which integrates multiple chiplets ...

In October 2010 Xilinx announced its use of a 2.5D through-silicon via (TSV) approach for their Virtex-7 FPGAs. This was followed by announcements from TSMC, Samsung, Nokia, Micron, and Elpida about ...

A new technical paper titled “Leveraging 3D Technologies for Hardware Security: Opportunities and Challenges” was published by researchers at the University of California, Santa Barbara and Columbia ...

Two software tools, Innovator3D IC and Calibre 3DStress, address chiplet integration and thermal management at the transistor level. Siemens Digital Industries Software announced the duo at DAC 2025.

Stratasys' "programmable materials" are a technological breakthrough. Just when many folks on Main Street were being introduced to 3D printing last year, a new technology that makes it seem downright ...